Extreme Testing: Building a precise and clean room environment for bonding equipment
Release time:
2025-04-22
Jicai (Nanjing) Technology Co., Ltd., with its deep technological accumulation and continuous passion for innovation, brings unprecedented precision environmental control system solutions to the semiconductor and other precision manufacturing industries. The precision cleanroom environment it creates can achieve high-precision temperature control of ±0.002℃, ±0.005℃, ±0.05℃, ±0.01℃ and other different levels for bonding equipment, with a clean environment of class 10, 100, and 1000.
JicTest (Nanjing) Technology Co., Ltd., a subsidiary of Nanjing Tuochang Technology, leverages its deep technological foundation and unwavering commitment to innovation to deliver unprecedented precision environmental control system solutions for the semiconductor and other precision manufacturing industries. Its precision cleanroom environment enables bonding equipment to achieve high-precision temperature control at various levels: ±0.002℃, ±0.005℃, ±0.05℃, ±0.01℃, etc. ， Cleanroom cleanliness levels of Class 10, 100, and 1000. Tailored solutions are available to meet individual customer needs regarding temperature and humidity stability, dimensions, cleanliness, anti-vibration, anti-magnetic interference, and sound insulation. The company has served numerous leading chip and semiconductor companies and national key laboratories.
Semiconductor manufacturing bonding equipment has extremely high environmental requirements. It needs to operate in a constant temperature, constant humidity, and high-cleanliness environment, while strictly controlling vibration and static electricity. These requirements aim to ensure the stability of the material activity at the bonding interface, meet the equipment's mechanical precision standards, avoid bonding deviations caused by temperature and humidity fluctuations, interface defects caused by particle contamination, or chip damage caused by static electricity, thereby ensuring bonding accuracy at the micrometer and sub-micrometer levels, as well as product yield and reliability.
The main cabinet of the equipment provides a stable operating space for the internal precision components; relying on high-precision temperature control technology, with an output accuracy of 0.1%. In addition, the equipment's airflow circulation system, driven by a fan to direct airflow circulation, combined with a high-efficiency clean filter, not only ensures uniform temperature distribution inside the equipment but also achieves an ultra-high cleanliness standard exceeding Class 100, with a working area cleanliness superior to ISO Class 3, creating a near-perfect R&D and production environment for precision instruments with stringent environmental requirements such as semiconductor lithography machines and bonding equipment.
In terms of data management, the equipment automatically generates visualized curves of key environmental parameters such as temperature and humidity, while equipment operating status and fault information are also synchronously recorded, facilitating full-process data traceability and in-depth analysis. It also uses a detachable aluminum alloy frame design, significantly improving the installation convenience of large equipment in different research locations; the appearance color can also be customized according to customer preferences, adapting to various application scenarios. In addition, the equipment is equipped with an automatic safety protection system with automatic fault protection capabilities, enabling all-weather stable operation.
