JiCe (Nanjing) creates a precise microenvironment for bonding equipment with a temperature control accuracy of ±0.002℃
Release time:
2025-08-27
JiCe (Nanjing) is redefining the environmental assurance boundaries of bonding equipment with a temperature control accuracy of ±0.002℃ and ISO class 1 cleanroom standards, providing critical support for overcoming environmental challenges in the domestic semiconductor industry chain.
In the semiconductor manufacturing field, bonding equipment serves as the core apparatus in the chip packaging process, and its process precision affects the reliability and lifespan of the chip.
The bonding process has stringent requirements for environmental temperature fluctuations and cleanliness. Jice (Nanjing), relying on its independently developed precision environmental control system , provides an ultra-stable operating environment for bonding equipment, becoming a key support for breaking through process challenges.
01 The Symbiotic Relationship Between Bonding Process and Environmental Control
Bonding equipment establishes a firm electrical connection between the chip and the substrate to achieve signal transmission and physical support. This process involves various technical routes such as thermocompression bonding and eutectic bonding. Regardless of the route, the environment demands are nearly stringent.
Minor temperature fluctuations cause mismatches in material thermal expansion coefficients, leading to alignment deviations; dust particles contaminate the bonding interface, causing cold solder joints or short circuits. These "invisible defects" are enough to significantly degrade or even cause failure of a high-end chip's performance.
02 Core Technological Breakthroughs of Jice Precision Environmental Control System
Facing the stringent requirements of the bonding process, the Jice precision environmental control system has achieved three core technological breakthroughs:
Nanometer-level Temperature Control: The system adopts a high-precision temperature control algorithm, capable of controlling temperature fluctuations in the bonding equipment's working area within ±0.002℃ (±2mK under static conditions), with temperature uniformity less than 16mK/m. This level of temperature stability ensures that material thermal deformation during bonding is compressed to the nanometer level, enabling high-precision bonding.
Ultra-high Cleanliness Guarantee: The system can achieve a clean environment of up to ISO Class 1 (≤10 particles ≥0.1μm per cubic meter), greatly reducing the risk of bonding defects caused by particles.
Humidity and Pressure Coordinated Control: Besides temperature control precision and cleanliness, the system can maintain humidity stability within ±0.3%RH and pressure fluctuation within ±3Pa. This multi-parameter coordinated control capability provides comprehensive and continuous stable environmental assurance for the bonding process.
03 Full-Scenario Customized Solutions
The Jice precision environmental control system not only excels in performance but also has strong non-standard customization capabilities, flexibly adjusting system configurations. Whether it is temperature stability, cleanliness level, or special requirements such as micro-vibration resistance and electromagnetic interference protection, Jice can provide targeted solutions. This flexibility allows the Jice system to adapt to various bonding equipment and meet diversified production needs.
04 Data Traceability and Intelligent Operation & Maintenance
The system is equipped with an intelligent monitoring platform that can record operational data in real time and automatically generate change curve reports. This data supports one-click export, providing a solid basis for production process traceability and quality analysis. The intelligent operation and maintenance system also features fault self-diagnosis and early warning functions, ensuring continuous and stable operation of bonding equipment.
Jice (Nanjing), with a temperature control accuracy of ±0.002℃ and ISO Class 1 cleanliness standards, is redefining the environmental assurance boundaries for bonding equipment, providing key support for overcoming environmental challenges in the domestic semiconductor industry chain.
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