Achieving Local Environmental Temperature Stability: An Analysis of Jice (Nanjing) Local Air Bath Technology
Release time:
2026-03-05
Relying on years of accumulated expertise in precision temperature control technology, Jice (Nanjing) has developed a localized environmental temperature stabilization solution that combines high precision with exceptional adaptability. At the heart of this solution is its proprietary local gas-bath technology, which provides customized temperature-control solutions for precision semiconductor equipment.
In precision manufacturing fields such as chip semiconductors and high-end optical imaging, the temperature stability of the local environment in equipment is a critical factor determining product accuracy and core performance. Take, for example, OCD (Optical Coherence Tomography) equipment—a key component in semiconductor manufacturing. The issue of localized heat accumulation in the light source module not only directly leads to a reduction in the lifespan of core components but also adversely affects the output accuracy of the equipment. Jice (Nanjing) Leveraging years of accumulated expertise in precision temperature control technology, we have developed a localized environmental temperature stability solution that combines high precision with exceptional adaptability. At the heart of this solution is our proprietary local gas-bath technology, which provides a customized temperature-control approach for precision semiconductor equipment.
I. In-depth Exploration of Industry-Specific Pain Points in Temperature Control: The Core Technological Barriers to Precise Local Temperature Control in Advanced Equipment
1. The precision threshold is difficult to surpass: Core components such as semiconductor metrology probe tips and light source modules for OCD equipment demand temperature stability at the micrometer level, requiring temperature fluctuations to be strictly confined within a range of ±0.05℃. In some high-end process applications, even more stringent requirements—such as ±0.005℃—are imposed. Traditional temperature-control technologies, constrained by their control logic, are unable to achieve such fine-grained temperature regulation.
2. Lack of Multi-Condition Adaptability: In semiconductor manufacturing processes, certain critical equipment must simultaneously achieve the dual objectives of establishing a globally stable temperature environment and precisely controlling localized hotspots. Traditional temperature-control solutions rely on a single control mode, which fails to provide targeted regulation for specific local areas, making it difficult to achieve precise coverage and temperature balance of hotspots.
3. Imbalance between airflow and cleanliness: In traditional air-bath temperature control systems, high-flow-rate airflow designs are commonly adopted to maximize heat dissipation efficiency. However, this design tends to cause particulate matter to become suspended in the cleanroom environment, thereby compromising the ISO Class 3 or higher cleanliness standards essential for semiconductor manufacturing and directly affecting the yield of wafer inspections. Meanwhile, the vortices generated by the high-flow-rate airflow can interfere with the operational accuracy of sensitive components in the equipment, leading to secondary performance degradation.
II. Decomposition of Local Air Bath Technology: Coordinated Design for Multi-Level Temperature Control and Cleanroom Protection
1. Multi-level independent temperature control architecture: Establish a “global-local” dual-loop temperature control system.
Global Constant-Temperature Base: Utilizing a sophisticated temperature-control algorithm, the device’s overall operating environment is stabilized at a baseline of 22℃ (with on-demand adjustment capability). Temperature stability reaches a peak of ±0.002℃, providing a stable environmental foundation for localized temperature control.
Localized Directed Air Bath: A customized, directed-air-curtain jet structure is designed specifically for core heat-generating areas such as the OCD light source module, laser interferometer probe, and lithography machine chamber. By dynamically coordinating air flow velocity and temperature, this system effectively avoids local thermal diffusion interference, achieving an exceptional localized temperature control accuracy of ±0.002℃.
2. Integrated design for cleanliness and anti-interference: Suitable for demanding precision manufacturing environments.
The cleanliness and low-interference requirements of semiconductor precision equipment are just as critical as temperature-control accuracy. Through optimization of its modular structure, Jice (Nanjing) has achieved a dual function in its localized air-bath devices: clean protection and anti-interference capabilities.
Ultra-high cleanliness standard: The cleanliness inside the module reaches ISO Class 1 (with fewer than 10 particles per cubic meter, each particle measuring 0.1 μm in diameter), fully meeting the stringent cleanliness requirements of high-precision manufacturing applications such as semiconductor wafer inspection and lithography machine operation.
Low-noise and Anti-interference Protection: Equipped with a low-noise fan assembly (operating noise ≤ 45 dB) and featuring a specially designed vibration-damping structure. Through precise calibration of airflow velocity and the synergistic effect of buffer chambers and air curtain barriers, the system ensures uniform airflow coverage over the temperature-controlled zone, eliminates vortex formation, and prevents interference with the operation of sensitive components.
3. Modular customized design: Suitable for installation in confined spaces.
Unlike conventional, general-purpose temperature-control devices, the localized air-bath solution developed by Jice (Nanjing) adopts a modular design philosophy. It can be custom-tailored to suit the structural characteristics and temperature-control requirements of various precision instruments, allowing it to be flexibly integrated into space-constrained environments such as the internal cavities of wafer inspection equipment, the confined chambers of lithography machines, and the core areas of laser interferometers, thereby quickly achieving efficient heat dissipation and stable temperature control at localized hotspots.
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