From the Cleanroom to the Heart of the Equipment: Jice UPECS Creates a “Microenvironment” for Semiconductor Equipment
Release time:
2026-04-15
When overarching environmental control meets the precision demands at the equipment level, refined custom non-standard solutions become the key to breaking the impasse.
Recently, Jice (Nanjing) Technology Co., Ltd. has received inquiries from several semiconductor equipment manufacturers, all of whom have raised a common challenge: how to provide customized, independent microenvironment control that meets even higher standards for precision equipment—beyond the overarching environmental control measures in cleanrooms?
This is precisely the core value of Jice UPECS, the ultra-precision environmental control system— Downstreaming from “room-level” environmental control to “equipment-level” microenvironment customization, we provide embedded precision environmental control solutions for high-end semiconductor equipment.
UPECS System: Breaking Through Broad Environmental Constraints and Defining Equipment-Level Environmental Control Standards
Ultra-Precision Environmental Control System (UPECS)
This is not a conventional cleanroom air-conditioning system; rather, it is a high-precision environmental-control unit specifically designed for the micro-environments of semiconductor equipment, precision instruments, and process modules. Its core technical specifications have redefined the industry standard for equipment-level environmental control:
Temperature stability: up to ±0.002°C (±2 mK), representing an order-of-magnitude improvement over the industry standard of ±0.01°C.
Humidity stability: up to ±0.1% RH, minimizing refractive-index fluctuations in the optical path and reducing electrostatic risks.
Cleanliness Class: Up to ISO Class 1
Noise Control: ≤45 dB, meeting the low-interference requirements of precision measurement applications.
Modular architecture tailored to the “embedded” requirements of devices.
The high-precision environmental control system is primarily composed of a main equipment cabinet, a control system, an air circulation system, a clean-air filtration system, a refrigeration (heating) system, an illumination system, and localized air-bath modules (ABMs), all working in concert. It meets diverse user requirements for temperature control, water-temperature control, humidity control, cleanliness, air-pressure control, micro-vibration resistance, and anti-magnetic shielding. To address the customized needs of semiconductor equipment frameworks, Jice UPECS adopts a modular design approach, allowing each functional unit to be selectively configured as required, enabling rapid on-site deployment and seamless integration with the equipment’s industrial design.
Scenario-Based Customization: Covering Key Semiconductor Equipment Use Cases
Jice’s UPECS platform boasts comprehensive, non-standard customization capabilities across all scenarios, enabling deep adaptation to the unique requirements of various semiconductor equipment:
Lithography Equipment Frame Assembly
Lithographic optical systems are extremely sensitive to temperature fluctuations; even a 0.1°C deviation can lead to pattern distortion. UPECS employs a closed-loop airflow circulation system combined with a high-precision PID control algorithm to maintain temperature stability within ±2 mK in the exposure zone. Coupled with CFD-based airflow simulation and optimization, this approach eliminates vortices and stagnant flow regions, thereby ensuring the overlay accuracy required for multi-pattern exposure (MPC).
Environmental Support for Semiconductor Metrology Equipment
OCD measurement equipment is highly sensitive to both micro-vibrations and thermal drift. UPECS addresses these challenges through comprehensive environmental precision control combined with localized air-bath (ABM) technology, enabling point-to-point temperature control of heat-generating components such as electronic control units and moving parts. At the same time, it incorporates anti-microvibration design to ensure nanometer-level measurement repeatability.
Microenvironment Control for Bonding Equipment
For processes such as flip-chip and hybrid bonding in 3D packaging, UPECS provides millikelvin-level temperature control and ISO Class 1 cleanroom conditions to prevent particle-induced cold solder joints, while multi-parameter synergy further enhances bonding yield.
Unmatched Confidence: Giving Every Device Its Own Exclusive “Microenvironment”
Currently, Jice (Nanjing) Technology Co., Ltd. has established a comprehensive capability chain spanning from R&D to delivery. With 100% in-house control over critical processes, the company ensures product consistency and on-time delivery. Amid the global trends of increasing precision and domestication in semiconductor equipment, The capability for microenvironment control integrated with equipment has become a key criterion for distinguishing high-end equipment from general-purpose equipment. Through non-standard, customized design, Jice UPECS condenses environmental control precision that far exceeds cleanroom standards into a compact equipment chassis, providing semiconductor equipment manufacturers with “plug-and-play” precision environmental assurance.
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