I. What is Semiconductor Measurement Equipment?

Semiconductor metrology equipment is used throughout the entire semiconductor manufacturing process to measure parameters such as the physical dimensions, material properties, electrical performance, and micro‑morphology of wafers, photomasks, and chips. Nanometer‑to‑subnanometer‑level precise quantitative measurement The core equipment, together with defect‑inspection tools, is collectively referred to as semiconductor metrology equipment and is hailed as the “precision ruler” of chip manufacturing.

It spans the entire process—from front-end wafer fabrication and advanced packaging to final testing—playing a pivotal role in real-time verification that each process step adheres to design specifications, managing process variability, locking the process window, and preventing mass‑scale scrap. It serves as a critical enabler for improving chip yield during ramp-up and for scaling advanced manufacturing processes; the more advanced the node, the more stringent the requirements for metrology accuracy.

Based on their core functions, main flow measurement devices can be classified into five major categories:

1.  Surface Morphology and Critical Dimension Measurement Equipment : Centered on critical dimension scanning electron microscopy (CD-SEM) and atomic force microscopy (AFM), it measures key nanoscale parameters such as transistor gate linewidth, step height, and surface roughness, serving as a core quality-control tool for lithography processes.

2.  Overlay Measurement Equipment It is specifically designed to measure alignment errors between different process layers on a wafer. In advanced manufacturing processes, overlay accuracy must be controlled at the sub-nanometer level, making it a core piece of equipment that supports multi-layer stacking and EUV lithography.

3.  Thin-film characterization equipment : Centered on ellipsometers and spectral reflectometers, it enables precise measurement of thin-film thickness, refractive index, stress, uniformity, and other parameters, covering nearly all stages of thin-film fabrication—including oxide layers, metal layers, and photoresist layers.

4.  Materials and Component Measurement Equipment : Including secondary ion mass spectrometry (SIMS), X-ray diffraction (XRD), and other instruments, these are used to analyze material doping concentrations, elemental distributions, crystal structures, and more, thereby supporting the control of core processes such as doping and epitaxy.

5.  Electrical Characteristic Measurement Equipment : Centered around a probe station and a semiconductor parameter analyzer, electrical parameters such as wafer resistivity, threshold voltage, and leakage current are measured to verify whether device performance meets the required specifications.

II. Core Environmental Requirements for Semiconductor Metrology Equipment

The nanometer‑to‑subnanometer measurement accuracy of semiconductor metrology equipment imposes extremely stringent requirements on the operating environment. Even the slightest environmental fluctuations can distort measurement data, thereby compromising chip yield; hence, a multi‑dimensional, high‑precision operating environment must be established. Temperature control is fundamental and critical: key components such as lenses, sensors, and probes are highly sensitive to temperature changes, and thermal expansion and contraction can directly shift the measurement reference. Conventional specifications call for ambient temperatures to remain stable at 23°C ± 0.1°C; for certain advanced‑process equipment, temperature variations must be kept within ±0.05°C, while eliminating temperature gradients across the cleanroom and isolating the system from external heat and cold sources. Humidity management is equally crucial: relative humidity should be maintained between 45% and 55%. Excessive humidity can lead to condensation on optical components, resulting in blurred imaging and measurement errors, and may also corrode precision circuits and metallic parts. Conversely, insufficient humidity can generate static electricity, damaging wafers and electronic components; therefore, dedicated constant‑humidity systems and electrostatic discharge (ESD) mitigation devices are essential.

Vibration control is essential for precise metrology. With measurement‑tool probes and imaging lenses operating at the nanometer scale, even minute vibrations—whether from ground motion, equipment operation, or personnel movement—can cause probe misalignment and image distortion. Consequently, the metrology cleanroom must be built on an independent vibration‑isolated foundation, and each piece of equipment must be mounted on a dedicated vibration isolation table, ensuring that vibration acceleration remains below 0.1 g and high‑frequency vibration amplitudes are kept within 1 nm. Cleanliness requirements must meet Class 1 standards, with no more than 10 particles ≥0.1 µm per cubic meter of air; even tiny dust particles can adhere to wafer surfaces or optical components, leading to measurement errors and wafer scratches. Therefore, the facility must be equipped with a high‑efficiency air filtration system, and personnel entering must wear full‑body cleanroom protective gear. In addition, electromagnetic shielding is indispensable: metrology instruments rely on precise electronic signal transmission, and external power‑grid fluctuations, electromagnetic emissions from other devices, and wireless signals can all interfere with data acquisition. The cleanroom must therefore incorporate electromagnetic shielding, and each instrument must be fitted with a dedicated grounding system to maintain grid voltage stability within ±1%.

III. Supporting Infrastructure for Measurement Scenarios: Jice’s high-precision environmental control system empowers accurate measurement.

JiCe’s core business focuses on providing high‑precision environmental control systems tailored to semiconductor metrology equipment, precisely meeting the stringent environmental requirements of such devices and delivering essential environmental safeguards to ensure stable, accurate operation—thereby helping to enhance quality and efficiency in the chip‑metrology process. In line with the environmental specifications outlined above, JiCe’s high‑precision environmental control system enables comprehensive, precise regulation of all key environmental parameters, including ultra‑high‑accuracy temperature and humidity control, cleanliness management, vibration isolation, and electromagnetic shielding, thereby seamlessly supporting the nanometer‑scale measurement needs of metrology tools. Its temperature‑control module boasts exceptional thermal stability, achieving an ultimate temperature‑control accuracy of ±0.002°C—far surpassing the conventional standard of 23°C ±0.1°C—ensuring not only consistent compliance with typical metrology‑room temperature requirements but also satisfying the rigorous demands of advanced‑node equipment. The integrated clean‑room system delivers Class 1 cleanliness, while the humidity‑control module can maintain relative humidity within ±0.1%RH. Coupled with vibration‑damping and electromagnetic‑shielding features, these capabilities protect metrology equipment from external disturbances, guaranteeing the utmost precision of measurement data. Moreover, JiCe’s high‑precision environmental control systems offer customized solutions designed to meet the specific operational needs of various types of metrology equipment, covering the entire metrology workflow—from front‑end wafer fabrication to advanced packaging—and, by exceeding industry‑standard performance thresholds, provide robust support for the reliable operation of domestically produced semiconductor metrology tools.