When “General Thermal Management” Hits the Precision Ceiling

The concept of a “thermal management system” is far from new. From cooling automotive engines to dissipating heat in data centers, from tempering industrial equipment to HVAC systems in buildings, the core principle of thermal management has always revolved around a simple goal: removing excess heat.

However, in high-end manufacturing sectors such as semiconductor fabrication, precision optics, and quantum computing, this falls far short of what is needed. Take lithography machines as an example: even a temperature fluctuation of 0.01°C can cause misalignment of circuit patterns on a wafer, leading to the scrapping of the entire wafer. The same holds true for bonding equipment—minute temperature variations can result in mismatches in the thermal expansion coefficients of materials, causing alignment errors; meanwhile, dust particles can contaminate the bonding interface, leading to cold solder joints or short circuits. For a long time, high‑end precision temperature‑control systems have been monopolized by foreign brands and remain prohibitively expensive, thereby hindering the development of China’s domestic high‑end manufacturing industry. Jice’s mission is precisely to break this impasse.

JiCe UPECS — From “Heat Dissipation” to “Environment Creation”

The answer offered by Jice is not a better heatsink, but rather a system‑level solution that can actively create an “ideal environment”— High-Precision Environmental Control System UPECS It provides precision environmental systems tailored for high-end equipment such as lithography machines, bonding tools, and laser interferometers, ensuring their output accuracy. The system has advanced from single-point control to enabling the coordinated operation of multiple parameters—including temperature, humidity, cleanliness, and air pressure—within a unified control framework, achieving a leap in temperature stability from the industry‑standard ±0.01°C to ±0.002°C.

From “Space” to “Medium”: Building a Closed-Loop Precision Thermal Management System for All Scenarios—Liquid, Gaseous, and Spatial

If UPECS addresses the challenge of temperature control in equipment‑integration environments, then Jice’s high‑precision cooling water chillers and high‑precision gas temperature controllers further extend its capabilities in precision thermal management.

High-precision chiller: By delivering circulating cooling water at a constant temperature, it actively removes heat generated by localized heat sources such as lasers, electron-beam guns, and high-power chip test stations. Its outlet water temperature stability can reach as high as ±0.002°C, with a temperature range spanning 5°C to 35°C, ensuring stable thermal conditions for the cooled components.

High‑precision gas temperature controller (ACU): In semiconductor cleanrooms, the temperature fluctuations of compressed air or nitrogen used for purging, carrier transport, or air‑bearing systems can directly propagate to the wafer surface, leading to overlay errors. The Jice ACU maintains source‑gas temperature stability within ±0.01°C, with a flow range of 10–2500 L/min, while simultaneously providing precise filtration. It delivers a stable, clean “gas bath” to support wafer handling and air‑bearing platforms.

Jice commits to “precision temperature control within ±0.002℃” and is dedicated to becoming a trusted, long-term technology partner in the high-precision environmental control sector, continuously advancing the localization of high-end equipment.