Geasure (Nanjing) Technology Co., Ltd.'s Precision Water-Cooled Chilled Water Unit With Millikelvin-level temperature control accuracy (±0.001℃) fast response capability, and high stability design, it has become the standard temperature control equipment in core processes of semiconductor manufacturing such as etching and deposition equipment, wafer manufacturing, and chip testing. This article analyzes how the unit achieves precise temperature control throughout the entire process through patented technology, based on the stringent temperature requirements of semiconductor processes, helping to improve chip yield and production efficiency, and providing temperature control equipment selection and application references for users in the semiconductor industry.

I. "Temperature Pain Points" in Semiconductor Manufacturing: How Insufficient Accuracy Affects Nanometer-Scale Processes?

• Etching and Deposition Processes : Processes such as extreme ultraviolet (EUV) lithography and plasma etching require temperature fluctuations to be controlled within ±0.01℃. If temperature drift exceeds the threshold, it may lead to uneven etch depth, thin film stress cracking, and other issues;
• Wafer Growth and Processing : During silicon single crystal growth, temperature gradient changes can cause lattice defects, affecting wafer electrical performance;
• Chip Testing Process : Environmental temperature fluctuations may increase test instrument errors, leading to misjudgment in chip sorting.
  Geasure Precision Water-Cooled Chilled Water Unit With ±0.001℃ temperature control accuracy (far exceeding industry standards) and dynamic load adaptability precisely solves the above pain points, becoming the "temperature guardian" of semiconductor processes.

II. Precision Water-Cooled Chilled Water Unit: The "Temperature Control Hub" for Semiconductor Processes

(I) How Do Core Technologies Adapt to Stringent Semiconductor Requirements?

1. The Technical Secret of Millikelvin-Level Temperature Control
   • Patented PID + Step-by-Step Temperature Control : Through the patent "Ultra-High Precision Process Cooling Water System and Its Constant Temperature Control Method", combined with self-developed temperature acquisition modules and multi-stage refrigeration circuit design, it achieves control over the etching machine chamber temperature of ±0.001℃ level control for example, in EUV lithography machines, it can ensure that the thermal deformation of photoresist during exposure is less than 1 nanometer;
   • Plate Heat Exchanger Enhanced Heat Transfer : Microchannel structure and stainless steel material improve heat exchange efficiency by over 30%, while avoiding copper ion contamination (a material prohibited in the semiconductor industry), meeting the wafer manufacturing's requirements for water purity.
2. Anti-interference and Fast Response Capability
   • Dual Compressor Redundancy Design : In 24-hour continuous production in wafer fabs, when a single compressor fails, the standby module can quickly and automatically switch in, preventing process interruption due to downtime;
   • Variable Frequency Technology for Dynamic Temperature Adjustment : By regulating the cooling capacity via compressor frequency conversion, the temperature recovery time is greatly shortened when facing multi-station load switching in the chip testing process.

(II) Analysis of Full-Process Application Scenarios

1.  Etching and Deposition Equipment: The Temperature Cornerstone of Nanometer-Scale Processes

• Application Challenges : During plasma etching, RF power heating can cause reaction chamber temperature fluctuations. If it exceeds ±0.05℃, it may lead to a decrease in etch selectivity (e.g., increased deviation in etch rates between SiO₂ and Si), affecting pattern transfer accuracy;
• Solution ：
  • Precision Water-Cooled Chilled Water Unit Through constant temperature chilled water circulation it provides 20℃±0.001℃ cooling to the electrodes and chamber walls of the etching machine, ensuring stable chemical activity of reaction gases;
  • In ALD (Atomic Layer Deposition) equipment, the unit provides precise temperature control for the heating plate, improving film deposition thickness uniformity to over 99.5% (industry average 95%).

2.  Wafer Manufacturing: Temperature Closed Loop from Growth to Dicing

• Single Crystal Growth Process ：
  • In Czochralski silicon single crystal growth, Precision Water-Cooled Chilled Water Unit it provides ±0.01℃ temperature control for the crystal furnace's cooling system, controlling the solid-liquid interface temperature gradient to <0.5℃/cm, reducing oxygen vacancy defects (which affect chip breakdown voltage);
• Wafer Dicing Process ：
  • The cooling water temperature control accuracy of diamond wire cutting machines directly affects the cutting surface roughness. The unit achieves this through dual-channel refrigeration design controlling water temperature fluctuations to **±0.005℃**, reducing cutting crack depth to below 5μm (traditional process >10μm), and improving wafer utilization.

3.  Chip Testing: Environmental Stability as an "Invisible Rigid Demand"

• Test Pain Points : Semiconductor parameter analyzers (e.g., Keysight B1500) are sensitive to ambient temperature. Every 1℃ change in temperature increases the source meter current measurement error by 0.1%, which may lead to misjudgment of low-leakage chips (e.g., standby current testing for MCUs);
• Unit Value ：
• In the temperature-controlled chamber of a test handler, the unit achieves this through single-channel precise temperature control stabilizing the ambient temperature at 25℃±0.02℃ combined with integrated temperature and humidity control, reduces test data repeatability error to <0.5%;
• For RF testing (e.g., 5G chip PA modules), the unit's low-vibration design (noise <50dB) prevents mechanical vibrations from interfering with microwave signal transmission, improving test consistency.

III. Key considerations for semiconductor temperature control equipment selection: Why prioritize precision water-cooled chiller units?

1. Precision matching process requirements : For advanced processes below 7nm, ±0.001℃-grade units are required; for mature processes (28nm and above), ±0.01℃-grade models can be selected;
2. Reliability design considerations : Prioritize models with *dual-circuit redundancy and anti-vibration design (e.g., adaptable to ISO 14644-1 Class 5 cleanroom standards)* to prevent micro-vibrations in semiconductor fabs from interfering with temperature control;
3. Energy saving and compliance : Choose permanent magnet variable frequency compressor (IE4 energy efficiency) + R410A refrigerant units, complying with SEMI standards and carbon neutrality requirements, such as Jicai units consuming 25% less energy than traditional models at full load.